TSMC: Its silicon photonics integration platform COUPE is expected to enter mass production this year

Golden Ten Data April 1 | According to Taiwan Economic Daily, TSMC stated that its silicon photonics integration platform COUPE is expected to enter mass production this year, becoming a key milestone in the implementation of co-packaged optics (CPO) and marking the countdown to industrialization of AI optical communication. The COUPE platform reportedly uses SoIC technology to integrate optical engines and various computing and control ASICs onto the same package substrate or interposer, bringing components closer together, increasing bandwidth and power efficiency, and reducing electrical coupling losses.