TSMC accelerates the expansion of its advanced packaging business in the United States and Taiwan

Glonghui, April 13th｜According to the Taiwan Economic Daily, TSMC’s advanced packaging capacity is in short supply, and the company is accelerating expansion both in Taiwan and the United States. Industry sources report that to meet rapid growth in AI applications from both Apple and non-Apple sectors, TSMC is fully committed to building its first advanced packaging plant in the United States (AP9), which is expected to start production in 2028 and will manufacture InFo and CoWoS packaging products. In Taiwan, the company will accelerate the expansion of SoIC capacity, with monthly output expected to reach 40,000 wafers by 2027.