Malaysia plans to form an advanced packaging alliance within two years, investing over 185 million ringgit.

```htmlAccording to Golden Ten Data on May 8, Malaysia plans to develop its advanced semiconductor packaging capabilities over the next two years by establishing the Malaysia Advanced Packaging Alliance (MAPC). Malaysian Minister of Science, Technology and Innovation, Chang Lih Kang, stated that the alliance is jointly formed by five local enterprises and the government through matching grants and "national collaboration". By integrating public sector and industrial resources, advanced packaging capabilities will be established. Chang Lih Kang said, "The government has approved a research and development grant of 92 million ringgit for this project within 24 months, while the industry has invested 93 million ringgit, bringing the total investment to 185 million ringgit. The main goal is to drive Malaysia up the semiconductor value chain." Malaysian Minister of Economy, Rafizi Ramli, said that semiconductor development is one of the key sectors under Malaysia's 13th Malaysia Plan (13MP), especially in industries with high impact and high added value.```