IBM, Siemens Team Up to Advance 3D Nanostack Chip Technology

08:42 AM EDT, 10/14/2026 (MT Newswires) -- IBM (IBM) said Wednesday it is collaborating with Siemens to develop its nanostack transistor architecture, which would fit more transistors onto a chip. The company said the architecture would also allow different materials in each stacked layer to improve transistor performance and power efficiency independently, with potential benefits for energy efficiency and chip memory scaling. IBM and Siemens will develop virtual models to test performance, optimize designs and identify manufacturing challenges before chips are built, it added. IBM said the work will also support future versions of nanostack beyond the current 7-angstrom node.